Konferenzprogramm 2022

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Liquid-to-air cooling: enabling direct to chip liquid cooling in air-cooled facilities

11 May 2022
Critical Infrastructure Theatre
Liquid-to-air cooling: enabling direct to chip liquid cooling in air-cooled facilities

Direct to chip / high density liquid cooling (HDLC) gains in importance in data centers as it provides a high potential to improve the efficiency of the cooling system. However, a typical HDLC setup requires a facility plumbing system directly in the IT white space. This may not be accepted, or may not make sense for each facility, especially if only a small portion of the installed equipment requires direct liquid cooling. For those cases, a solution is to dissipate the heat from the water into the data center air. Two possible solutions will be shown serving that purpose along with performance, efficiency and cost considerations.

Language

EN

Sponsors

GOLD SPONSOR

  • Mitsubishi
  • Vertiv

 

SILVER SPONSOR


  • DTM Group
  • Sunbird Software, Inc
  • Jaeggi-Hybrid
  • Piller
  • Paessler AG

 

Partners

PARTNER

  • German Datacentre Association

PARTNER

  • Sustainable Digital Infrastructure Alliance e.V

PARTNER

  • Dutch Data Centre Association

PARTNER

  • Virz

PARTNER

  • Enterprise Ireland

PARTNER

  • Uptime Institute

TRAVEL PARTNER

  • Lufthansa
  • Deutsche Bahn

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