Konferenzprogramm 2022

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Liquid-to-air cooling: enabling direct to chip liquid cooling in air-cooled facilities

11 Mai 2022
Critical Infrastructure Theatre

Direct to chip / high density liquid cooling (HDLC) gains in importance in data centers as it provides a high potential to improve the efficiency of the cooling system. However, a typical HDLC setup requires a facility plumbing system directly in the IT white space. This may not be accepted, or may not make sense for each facility, especially if only a small portion of the installed equipment requires direct liquid cooling. For those cases, a solution is to dissipate the heat from the water into the data center air. Two possible solutions will be shown serving that purpose along with performance, efficiency and cost considerations.

Speakers
Stefan Djuranec, Global Product Manager - DNS cooling

Sponsors

GOLD SPONSOR

  • Mitsubishi
  • Kelvion
  • Johnson Controls
  • Schäfer IT- Systems
  • Socomec
  • Schneider Electric
  • Innio Jenbacher
  • OVH Cloud

 

SILVER SPONSOR


  • Belden
  • Commscope
  • Covergint
  • GoFoton
  • Mann + Hummel
  • George Fischer
  • DPR
  • Dehn
  • Fath
  • Bouygues Energy & Services

 

Platinum Sponsor

  • Platinum Sponsor
  • Google Cloud
  • Huawei
  • Siemens

 

VIP SPONSOR

  • DEll Technologies
  • ABB

 

Partners

HEADLINE & PLATINUM PARTNER

  • ECO

CONTENT PARTNER

  • Horizon Cloud

COOPERATION PARTNER

  • Frankfurt Rhein Main

Innovation Partner

  • cropped-Logo_VIRZ_half_res-1

 

Partnered by

  • dunwoody

Medien Partner

  • Dutch Data Centre Association

MEDIEN PARTNER

  • German Tech Jobs

MEDIEN PARTNER

  • ADMIN Network & Security

MEDIEN PARTNER

  • Linux Magazine

MEDIEN PARTNER

  • IT Verlag

MEDIEN PARTNER

  • Women In Tech

MEDIEN PARTNER

  • <kes>

MEDIEN PARTNER

  • TechTarget

MEDIEN PARTNER

  • Enterprise Ireland

PARTNER

  • German Datacentre Association

REISEPARTNER

  • Lufthansa
  • Deutsche Bahn